Equipment
Innoptics relies on various apparatus in order to manufacture its products, assemble specific components for subcontracting activities or within collaborative programs.
Inspection
- Visual inspection
- Microscopes and binocular
- Dimensional measurement equipment
Gluing
- Dispensing equipment
- UV curing
- Thermal curing
Wire bonding
- Wire and ribbon bonding
- Ball bonding, wedge bonding
- Stud bumps
- Deep access / fine pitch
Reflow oven
- Programmable thermal profiles
- 450°C maximum temperature
- Controlled atmospheres
- Activating gas
- Inert gas / medium vacuum
Die bonding
- ±5µm placement accuracy
- Brazing, gluing, thermo-compression, ultrasonic welding
- Flip chip or regular die bonding
Mechanical Design
- Mechanical design
- Components and systems
- Assembly and test benches
Modelling
- Optical modelling
- Mechanical modelling
- Thermal and RF design
Measurments
- Current supplies
- TEC controllers
- Power meters (Visible to NIR & MIR, from 1 µW to 200 W, fast photodiodes)
- Beam characterization
- Optical Spectrum Analyser
- etc.