Innoptics is highly specialized in the packaging of optoelectronic components. We propose various services of customized packaging, from feasibility study to product design and manufacturing in small to medium quantities.
Our experts are used to handle optics, mechanics, thermal management and high frequency. Dealing with soldering of chip on submount as well as with package integration and wire bonding, we are also much involved in the process development and the design of dedicated microbenches for components assembly.
Being familiar with many processes and technologies, we select the most appropriate solution for each product development.
Integration of optoelectronic components often requires the development of dedicated micro-positioning benches, tools or fixtures for piece part assembly, as well as the set-up of specific assembly processes. For instance, demanding requirements such as reliability or hermetic sealing must be taken into account and require very specific means and assembly steps.
For most product developments, we propose a first phase dedicated to feasibility study, based on both modelling and experimental testing, in order to validate the concept, the technical choices and the targeted performances and trade-offs.
Some projects can hence be limited to feasibility study.
Optical microbench
Fiber coupling
Transceiver
DPSS with intra-cavity frequency dubbing.
HHL package integrating a pump LD (980nm) or QCL
Flip chip assembly of a 40 Gb/s LD on a silicon submount
Die bonding on substrate
Rosa & Tosa module
TX & RX 12x10G